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	<title>Automation &#8211; Electronics For You – Official Site ElectronicsForU.com</title>
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	<title>Automation &#8211; Electronics For You – Official Site ElectronicsForU.com</title>
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		<title>Are Indian Cobots Making Industrial Automation Truly Local?</title>
		<link>https://www.electronicsforu.com/news/are-indian-cobots-making-industrial-automation-truly-local</link>
					<comments>https://www.electronicsforu.com/news/are-indian-cobots-making-industrial-automation-truly-local#respond</comments>
		
		<dc:creator><![CDATA[Akanksha Gaur]]></dc:creator>
		<pubDate>Wed, 17 Sep 2025 11:36:47 +0000</pubDate>
				<category><![CDATA[Electronics News]]></category>
		<category><![CDATA[Automation]]></category>
		<category><![CDATA[Editor's Choice]]></category>
		<category><![CDATA[Market Verticals]]></category>
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		<category><![CDATA[Tech Of Robotics]]></category>
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		<guid isPermaLink="false">https://www.electronicsforu.com/?p=173530</guid>

					<description><![CDATA[<img width="150" height="150" src="https://www.electronicsforu.com/wp-contents/uploads/2025/09/Prajwal-Lale-150x150.jpg" class="webfeedsFeaturedVisual wp-post-image" alt="" style="display: block; margin-bottom: 5px; clear:both;max-width: 100%;" link_thumbnail="" decoding="async" />What if industrial robots were not just imported tools, but homegrown collaborators designed for India’s unique manufacturing challenges? An emerging startup is pioneering affordable, customizable cobots that combine patented tech and simple controls—reshaping automation for a new era. Here’s the innovation behind India’s robotic revolution… PL Robotics is emerging as a promising player in addressing [&#8230;]]]></description>
		
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		<title>RISC Based 3.5” SBC</title>
		<link>https://www.electronicsforu.com/news/risc-based-3-5-sbc</link>
					<comments>https://www.electronicsforu.com/news/risc-based-3-5-sbc#respond</comments>
		
		<dc:creator><![CDATA[Akanksha Gaur]]></dc:creator>
		<pubDate>Wed, 17 Sep 2025 05:19:09 +0000</pubDate>
				<category><![CDATA[Electronics News]]></category>
		<category><![CDATA[AI & ML Tech]]></category>
		<category><![CDATA[Automation]]></category>
		<category><![CDATA[Market Verticals]]></category>
		<category><![CDATA[New Products]]></category>
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		<guid isPermaLink="false">https://www.electronicsforu.com/?p=173433</guid>

					<description><![CDATA[<img width="150" height="150" src="https://www.electronicsforu.com/wp-contents/uploads/2025/09/IBASE_IBR500_image-150x150.jpg" class="webfeedsFeaturedVisual wp-post-image" alt="" style="display: block; margin-bottom: 5px; clear:both;max-width: 100%;" link_thumbnail="" decoding="async" />Built on RISC architecture delivers compact performance for AI, IoT, and edge applications. Featuring MediaTek Genio processors, onboard memory and storage, dual 4K displays, and up to 3.2 TOPS AI acceleration, it combines efficiency with scalability—making it a fit for industrial automation, smart retail, and connected edge solutions. The demand for compact, power-efficient edge computing [&#8230;]]]></description>
		
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		<item>
		<title>Wireless SoC Targets For IoT </title>
		<link>https://www.electronicsforu.com/news/wireless-soc-targets-for-iot</link>
					<comments>https://www.electronicsforu.com/news/wireless-soc-targets-for-iot#respond</comments>
		
		<dc:creator><![CDATA[Akanksha Gaur]]></dc:creator>
		<pubDate>Thu, 11 Sep 2025 07:55:16 +0000</pubDate>
				<category><![CDATA[Electronics News]]></category>
		<category><![CDATA[AI & ML Tech]]></category>
		<category><![CDATA[Automation]]></category>
		<category><![CDATA[Chip Design & Manufacture Tech]]></category>
		<category><![CDATA[Market Verticals]]></category>
		<category><![CDATA[New Products]]></category>
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		<guid isPermaLink="false">https://www.electronicsforu.com/?p=173151</guid>

					<description><![CDATA[<img width="150" height="150" src="https://www.electronicsforu.com/wp-contents/uploads/2025/09/np561-150x150.png" class="webfeedsFeaturedVisual wp-post-image" alt="" style="display: block; margin-bottom: 5px; clear:both;max-width: 100%;" link_thumbnail="" decoding="async" />Engineered for cost-sensitive markets, the latest wireless chip combines extended range, multi-year battery life, and built-in security to accelerate smart city, industrial, and automation deployments. Silicon Labs has expanded its Series 2 portfolio with the launch of the FG23L wireless system-on-chip (SoC), now shipping with developer kits available globally. General availability is slated for September [&#8230;]]]></description>
		
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		<title>Remote Controller Transforms Production</title>
		<link>https://www.electronicsforu.com/news/remote-controller-transforms-production</link>
					<comments>https://www.electronicsforu.com/news/remote-controller-transforms-production#respond</comments>
		
		<dc:creator><![CDATA[Akanksha Gaur]]></dc:creator>
		<pubDate>Mon, 08 Sep 2025 06:41:06 +0000</pubDate>
				<category><![CDATA[Electronics News]]></category>
		<category><![CDATA[Automation]]></category>
		<category><![CDATA[Components Corner]]></category>
		<category><![CDATA[Market Verticals]]></category>
		<category><![CDATA[New Products]]></category>
		<category><![CDATA[Tech Zone]]></category>
		<guid isPermaLink="false">https://www.electronicsforu.com/?p=172938</guid>

					<description><![CDATA[<img width="150" height="150" src="https://www.electronicsforu.com/wp-contents/uploads/2025/09/NP-150x150.jpg" class="webfeedsFeaturedVisual wp-post-image" alt="" style="display: block; margin-bottom: 5px; clear:both;max-width: 100%;" link_thumbnail="" decoding="async" loading="lazy" />Built to manage up to 200 PTZ cameras, it allows operators to automate complex sequences, streamline setup through a web-based interface, and monitor feeds directly on a built-in touchscreen. Panasonic has introduced its most advanced remote camera controller, the AW-RP200GJ, designed to elevate multi-camera broadcast and live event productions with new levels of efficiency and [&#8230;]]]></description>
		
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			</item>
		<item>
		<title>Shifting To Open And Scalable Industrial Automation</title>
		<link>https://www.electronicsforu.com/news/shifting-to-open-and-scalable-industrial-automation</link>
					<comments>https://www.electronicsforu.com/news/shifting-to-open-and-scalable-industrial-automation#respond</comments>
		
		<dc:creator><![CDATA[Nidhi Agarwal]]></dc:creator>
		<pubDate>Tue, 02 Sep 2025 06:08:38 +0000</pubDate>
				<category><![CDATA[Electronics News]]></category>
		<category><![CDATA[Automation]]></category>
		<category><![CDATA[Market Verticals]]></category>
		<category><![CDATA[New Products]]></category>
		<category><![CDATA[automation]]></category>
		<guid isPermaLink="false">https://www.electronicsforu.com/?p=172491</guid>

					<description><![CDATA[<img width="150" height="150" src="https://www.electronicsforu.com/wp-contents/uploads/2025/09/image002-1-150x150.jpg" class="webfeedsFeaturedVisual wp-post-image" alt="" style="display: block; margin-bottom: 5px; clear:both;max-width: 100%;" link_thumbnail="" decoding="async" loading="lazy" />Factories struggle with locked systems and slow updates. A new way promises open control that can grow with future needs. Read on! Industrial automation is under pressure to become open, flexible, and scalable. Manufacturers, energy providers, and logistics operators face challenges such as vendor lock-in, fragmented protocols, slow deployment cycles, and limited adaptability to future [&#8230;]]]></description>
		
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			</item>
		<item>
		<title>High-Voltage Programmable Resistor Boards </title>
		<link>https://www.electronicsforu.com/news/high-voltage-programmable-resistor-boards</link>
					<comments>https://www.electronicsforu.com/news/high-voltage-programmable-resistor-boards#respond</comments>
		
		<dc:creator><![CDATA[Akanksha Gaur]]></dc:creator>
		<pubDate>Mon, 01 Sep 2025 06:21:37 +0000</pubDate>
				<category><![CDATA[Electronics News]]></category>
		<category><![CDATA[Aerospace & Defence]]></category>
		<category><![CDATA[Automation]]></category>
		<category><![CDATA[Market Verticals]]></category>
		<category><![CDATA[New Products]]></category>
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		<category><![CDATA[Testing Times]]></category>
		<guid isPermaLink="false">https://www.electronicsforu.com/?p=172359</guid>

					<description><![CDATA[<img width="150" height="150" src="https://www.electronicsforu.com/wp-contents/uploads/2025/09/Screenshot-2025-09-01-114214-150x150.png" class="webfeedsFeaturedVisual wp-post-image" alt="" style="display: block; margin-bottom: 5px; clear:both;max-width: 100%;" link_thumbnail="" decoding="async" loading="lazy" />Designed for EV, aerospace, and energy test systems, the compact boards combine safety interlocks, calibration support, and four-channel density to validate inverters, BMS, and other next-gen power electronics. Pickering Interfaces has launched a new family of 1.2 kV PXI and PXIe programmable resistor modules designed to meet the rising demand for high-voltage simulation in electric [&#8230;]]]></description>
		
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		<item>
		<title>Interface Converters Power Global Connectivity</title>
		<link>https://www.electronicsforu.com/news/interface-converters-power-global-connectivity</link>
					<comments>https://www.electronicsforu.com/news/interface-converters-power-global-connectivity#respond</comments>
		
		<dc:creator><![CDATA[Akanksha Gaur]]></dc:creator>
		<pubDate>Tue, 26 Aug 2025 05:07:41 +0000</pubDate>
				<category><![CDATA[Electronics News]]></category>
		<category><![CDATA[Automation]]></category>
		<category><![CDATA[Components Corner]]></category>
		<category><![CDATA[Market Verticals]]></category>
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		<guid isPermaLink="false">https://www.electronicsforu.com/?p=171889</guid>

					<description><![CDATA[<img width="150" height="150" src="https://www.electronicsforu.com/wp-contents/uploads/2025/08/DSC03363-150x150.jpg" class="webfeedsFeaturedVisual wp-post-image" alt="" style="display: block; margin-bottom: 5px; clear:both;max-width: 100%;" link_thumbnail="" decoding="async" loading="lazy" />Designed for industrial automation, telecom, and energy networks, the innovation reflects India’s growing role in delivering world-class connectivity solutions. Sparr Electronics Ltd, a pioneer in embedded systems and networking solutions for over three decades, has unveiled its latest line of Interface Converters, designed and manufactured in India to serve global markets. These converters aim to [&#8230;]]]></description>
		
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		<item>
		<title>Robots Prevent Slips Through Movement</title>
		<link>https://www.electronicsforu.com/news/robots-prevent-slips-through-movement</link>
					<comments>https://www.electronicsforu.com/news/robots-prevent-slips-through-movement#respond</comments>
		
		<dc:creator><![CDATA[Akanksha Gaur]]></dc:creator>
		<pubDate>Thu, 14 Aug 2025 04:50:37 +0000</pubDate>
				<category><![CDATA[Electronics News]]></category>
		<category><![CDATA[Automation]]></category>
		<category><![CDATA[Market Verticals]]></category>
		<category><![CDATA[Medical]]></category>
		<category><![CDATA[Tech Of Robotics]]></category>
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		<guid isPermaLink="false">https://www.electronicsforu.com/?p=171108</guid>

					<description><![CDATA[<img width="150" height="150" src="https://www.electronicsforu.com/wp-contents/uploads/2025/08/tn-8-150x150.jpg" class="webfeedsFeaturedVisual wp-post-image" alt="" style="display: block; margin-bottom: 5px; clear:both;max-width: 100%;" link_thumbnail="" decoding="async" loading="lazy" />A bio-inspired slip prevention system that lets robots adjust their movements like humans, keeping fragile or slippery objects secure without crushing them — paving the way for safer, smarter automation in homes, factories, and healthcare. Robots have long struggled with one delicate challenge — holding on to objects without crushing or dropping them. Traditionally, the [&#8230;]]]></description>
		
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		<item>
		<title>Wafer Level And Back End Inspection Solutions</title>
		<link>https://www.electronicsforu.com/news/wafer-level-and-back-end-inspection-solutions</link>
					<comments>https://www.electronicsforu.com/news/wafer-level-and-back-end-inspection-solutions#respond</comments>
		
		<dc:creator><![CDATA[Akanksha Gaur]]></dc:creator>
		<pubDate>Tue, 12 Aug 2025 05:17:27 +0000</pubDate>
				<category><![CDATA[Electronics News]]></category>
		<category><![CDATA[Automation]]></category>
		<category><![CDATA[Chip Design & Manufacture Tech]]></category>
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		<guid isPermaLink="false">https://www.electronicsforu.com/?p=170921</guid>

					<description><![CDATA[<img width="150" height="150" src="https://www.electronicsforu.com/wp-contents/uploads/2025/08/TRI_Semicon_Taiwan_2025_20250731-150x150.jpg" class="webfeedsFeaturedVisual wp-post-image" alt="" style="display: block; margin-bottom: 5px; clear:both;max-width: 100%;" link_thumbnail="" decoding="async" loading="lazy" srcset="https://www.electronicsforu.com/wp-contents/uploads/2025/08/TRI_Semicon_Taiwan_2025_20250731-150x150.jpg 150w, https://www.electronicsforu.com/wp-contents/uploads/2025/08/TRI_Semicon_Taiwan_2025_20250731.jpg 350w" sizes="auto, (max-width: 150px) 100vw, 150px" />From chiplets and TSV metrology to ultra-fine wire and bump inspection, the latest semiconductor inspection and metrology technologies, promising higher yields, tighter process control, and enhanced reliability for next-generation packaging. TRI’s expanded inspection and metrology portfolio addresses the fast-evolving needs of advanced semiconductor manufacturing, covering applications such as chiplet and chip-on-wafer (CoW), system-in-package (SiP), advanced [&#8230;]]]></description>
		
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		<title>AI Predicts Thermoelectric Metal </title>
		<link>https://www.electronicsforu.com/news/ai-predicts-thermoelectric-metal</link>
					<comments>https://www.electronicsforu.com/news/ai-predicts-thermoelectric-metal#respond</comments>
		
		<dc:creator><![CDATA[Akanksha Gaur]]></dc:creator>
		<pubDate>Thu, 07 Aug 2025 06:30:22 +0000</pubDate>
				<category><![CDATA[Electronics News]]></category>
		<category><![CDATA[Automation]]></category>
		<category><![CDATA[Market Verticals]]></category>
		<category><![CDATA[Power Electronics Tech]]></category>
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		<guid isPermaLink="false">https://www.electronicsforu.com/?p=170713</guid>

					<description><![CDATA[<img width="150" height="150" src="https://www.electronicsforu.com/wp-contents/uploads/2025/08/tn-5-150x150.jpg" class="webfeedsFeaturedVisual wp-post-image" alt="" style="display: block; margin-bottom: 5px; clear:both;max-width: 100%;" link_thumbnail="" decoding="async" loading="lazy" />A TU Wien-led team combines supercomputing and automation to predict high-performance thermoelectric materials—shifting the search from trial-and-error to intelligent design. New technologies demand new materials—but discovering them can take decades. Now, a research team led by Andrej Pustogow at TU Wien has created an automated computer protocol that predicts thermoelectric materials capable of converting waste [&#8230;]]]></description>
		
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